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INTEGRATED CIRCUITS
DATA SHEET
PCF8591 8-bit A/D and D/A converter
Product specification Supersedes data of 1997 Apr 02 File under Integrated Circuits, IC12 1998 Jul 02
Philips Semiconductors
Product specification
8-bit A/D and D/A converter
CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 8 8.1 8.2 8.3 8.4 8.5 9 10 11 12 13 14 15 16 17 17.1 17.2 17.2.1 17.2.2 17.3 17.3.1 17.3.2 17.3.3 18 19 20 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Addressing Control byte D/A conversion A/D conversion Reference voltage Oscillator CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol LIMITING VALUES HANDLING DC CHARACTERISTICS D/A CHARACTERISTICS A/D CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCF8591
1998 Jul 02
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
1 FEATURES
PCF8591
* Single power supply * Operating supply voltage 2.5 V to 6 V * Low standby current * Serial input/output via I2C-bus * Address by 3 hardware address pins * Sampling rate given by I2C-bus speed * 4 analog inputs programmable as single-ended or differential inputs * Auto-incremented channel selection * Analog voltage range from VSS to VDD * On-chip track and hold circuit * 8-bit successive approximation A/D conversion * Multiplying DAC with one analog output. 2 APPLICATIONS 3 GENERAL DESCRIPTION The PCF8591 is a single-chip, single-supply low power 8-bit CMOS data acquisition device with four analog inputs, one analog output and a serial I2C-bus interface. Three address pins A0, A1 and A2 are used for programming the hardware address, allowing the use of up to eight devices connected to the I2C-bus without additional hardware. Address, control and data to and from the device are transferred serially via the two-line bidirectional I2C-bus. The functions of the device include analog input multiplexing, on-chip track and hold function, 8-bit analog-to-digital conversion and an 8-bit digital-to-analog conversion. The maximum conversion rate is given by the maximum speed of the I2C-bus.
* Closed loop control systems * Low power converter for remote data acquisition * Battery operated equipment * Acquisition of analog values in automotive, audio and TV applications. 4 ORDERING INFORMATION TYPE NUMBER PCA8591P PCA8591T
PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1
1998 Jul 02
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8-bit A/D and D/A converter PCF8591
BLOCK DIAGRAM
Philips Semiconductors
Product specification
8-bit A/D and D/A converter
6 PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 negative supply voltage I2C-bus data input/output I2C-bus clock input oscillator input/output external/internal switch for oscillator input analog ground voltage reference input analog output (D/A converter) positive supply voltage Fig.2 Pinning diagram. hardware address analog inputs (A/D converter) DESCRIPTION
PCF8591
SYMBOL AINO AIN1 AIN2 AIN3 A0 A1 A2 VSS SDA SCL OSC EXT AGND VREF AOUT VDD
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
7 7.1 FUNCTIONAL DESCRIPTION Addressing 7.2 Control byte
PCF8591
Each PCF8591 device in an I2C-bus system is activated by sending a valid address to the device. The address consists of a fixed part and a programmable part. The programmable part must be set according to the address pins A0, A1 and A2. The address always has to be sent as the first byte after the start condition in the I2C-bus protocol. The last bit of the address byte is the read/write-bit which sets the direction of the following data transfer (see Figs 3, 15 and 16).
The second byte sent to a PCF8591 device will be stored in its control register and is required to control the device function. The upper nibble of the control register is used for enabling the analog output, and for programming the analog inputs as single-ended or differential inputs. The lower nibble selects one of the analog input channels defined by the upper nibble (see Fig.4). If the auto-increment flag is set the channel number is incremented automatically after each A/D conversion. If the auto-increment mode is desired in applications where the internal oscillator is used, the analog output enable flag in the control byte (bit 6) should be set. This allows the internal oscillator to run continuously, thereby preventing conversion errors resulting from oscillator start-up delay. The analog output enable flag may be reset at other times to reduce quiescent power consumption.
Fig.3 Address byte.
The selection of a non-existing input channel results in the highest available channel number being allocated. Therefore, if the auto-increment flag is set, the next selected channel will be always channel 0. The most significant bits of both nibbles are reserved for future functions and have to be set to 0. After a Power-on reset condition all bits of the control register are reset to 0. The D/A converter and the oscillator are disabled for power saving. The analog output is switched to a high-impedance state.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
Fig.4 Control byte.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
7.3 D/A conversion
PCF8591
The on-chip D/A converter is also used for successive approximation A/D conversion. In order to release the DAC for an A/D conversion cycle the unity gain amplifier is equipped with a track and hold circuit. This circuit holds the output voltage while executing the A/D conversion. The output voltage supplied to the analog output AOUT is given by the formula shown in Fig.6. The waveforms of a D/A conversion sequence are shown in Fig.7.
The third byte sent to a PCF8591 device is stored in the DAC data register and is converted to the corresponding analog voltage using the on-chip D/A converter. This D/A converter consists of a resistor divider chain connected to the external reference voltage with 256 taps and selection switches. The tap-decoder switches one of these taps to the DAC output line (see Fig.5). The analog output voltage is buffered by an auto-zeroed unity gain amplifier. This buffer amplifier may be switched on or off by setting the analog output enable flag of the control register. In the active state the output voltage is held until a further data byte is sent.
Fig.5 DAC resistor divider chain.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
Fig.6 DAC data and DC conversion characteristics.
Fig.7 D/A conversion sequence.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
7.4 A/D conversion
PCF8591
The conversion result is stored in the ADC data register and awaits transmission. If the auto-increment flag is set the next channel is selected. The first byte transmitted in a read cycle contains the conversion result code of the previous read cycle. After a Power-on reset condition the first byte read is a hexadecimal 80. The protocol of an I2C-bus read cycle is shown in Chapter 8, Figs 15 and 16. The maximum A/D conversion rate is given by the actual speed of the I2C-bus.
The A/D converter makes use of the successive approximation conversion technique. The on-chip D/A converter and a high-gain comparator are used temporarily during an A/D conversion cycle. An A/D conversion cycle is always started after sending a valid read mode address to a PCF8591 device. The A/D conversion cycle is triggered at the trailing edge of the acknowledge clock pulse and is executed while transmitting the result of the previous conversion (see Fig.8). Once a conversion cycle is triggered an input voltage sample of the selected channel is stored on the chip and is converted to the corresponding 8-bit binary code. Samples picked up from differential inputs are converted to an 8-bit two's complement code (see Figs 9 and 10).
Fig.8 A/D conversion sequence.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
Fig.9 A/D conversion characteristics of single-ended inputs.
Fig.10 A/D conversion characteristics of differential inputs.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
7.5 Reference voltage 7.6 Oscillator
PCF8591
For the D/A and A/D conversion either a stable external voltage reference or the supply voltage has to be applied to the resistor divider chain (pins VREF and AGND). The AGND pin has to be connected to the system analog ground and may have a DC off-set with reference to VSS. A low frequency may be applied to the VREF and AGND pins. This allows the use of the D/A converter as a one-quadrant multiplier; see Chapter 15 and Fig.6. The A/D converter may also be used as a one or two quadrant analog divider. The analog input voltage is divided by the reference voltage. The result is converted to a binary code. In this application the user has to keep the reference voltage stable during the conversion cycle.
An on-chip oscillator generates the clock signal required for the A/D conversion cycle and for refreshing the auto-zeroed buffer amplifier. When using this oscillator the EXT pin has to be connected to VSS. At the OSC pin the oscillator frequency is available. If the EXT pin is connected to VDD the oscillator output OSC is switched to a high-impedance state allowing the user to feed an external clock signal to OSC.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
8 CHARACTERISTICS OF THE I2C-BUS
PCF8591
The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal.
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SDA
SCL data line stable; data valid change of data allowed
MBC621
Fig.11 Bit transfer.
8.2
Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH, is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH, is defined as the stop condition (P).
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SDA
SDA
SCL S START condition P STOP condition
SCL
MBC622
Fig.12 Definition of START and STOP condition.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
8.3 System configuration
PCF8591
A device generating a message is a `transmitter', a device receiving a message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves'.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.13 System configuration.
8.4
Acknowledge
The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited. Each data byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter whereas the master also generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
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DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START condition clock pulse for acknowledgement
MBC602
1
2
8
9
Fig.14 Acknowledgement on the I2C-bus.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
8.5 I2C-bus protocol
PCF8591
After a start condition a valid hardware address has to be sent to a PCF8591 device. The read/write bit defines the direction of the following single or multiple byte data transfer. For the format and the timing of the start condition (S), the stop condition (P) and the acknowledge bit (A) refer to the I2C-bus characteristics. In the write mode a data transfer is terminated by sending either a stop condition or the start condition of the next data transfer.
Fig.15 Bus protocol for write mode, D/A conversion.
Fig.16 Bus protocol for read mode, A/D conversion.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IDD, ISS Ptot PO Tamb Tstg 10 HANDLING PARAMETER supply voltage (pin 16) input voltage (any input) DC input current DC output current VDD or VSS current total power dissipation per package power dissipation per output operating ambient temperature storage temperature MIN. -0.5 -0.5 - - - - - -40 -65 +8.0 VDD + 0.5 10 20 50 300 100 +85 +150 MAX.
PCF8591
UNIT V V mA mA mA mW mW C C
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices".
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
11 DC CHARACTERISTICS VDD = 2.5 V to 6 V; VSS = 0 V; Tamb = -40 C to +85 C unless otherwise specified. SYMBOL Supply VDD IDD supply voltage (operating) supply current standby operating, AOUT off operating, AOUT active VPOR VIL VIH IL Power-on reset level VI = VSS or VDD; no load fSCL = 100 kHz fSCL = 100 kHz note 1 - - - 0.8 1 125 0.45 - - - - - - - - - - 100 - - 15 2.5 - PARAMETER CONDITIONS MIN. TYP.
PCF8591
MAX.
UNIT
6.0
V A A mA V
250 1.0 2.0 0.3 x VDD VDD +250 +1 5 -
Digital inputs/output: SCL, SDA, A0, A1, A2 LOW level input voltage HIGH level input voltage leakage current A0, A1, A2 SCL, SDA Ci IOL VREF VAGND ILI RREF ILI fOSC Notes 1. The power on reset circuit resets the I2C-bus logic when VDD is less than VPOR. 2. A further extension of the range is possible, if the following conditions are fulfilled: V REF + V AGND V REF + V AGND ------------------------------------- 0.8V, V DD - ------------------------------------- 0.4V 2 2 input capacitance LOW level SDA output current VOL = 0.4 V reference voltage analog ground voltage input leakage current input resistance pins VREF and AGND VREF > VAGND; note 2 VREF > VAGND; note 2 VI = VSS to VDD VI = VSS to VDD -250 -1 - 3.0 nA A pF mA 0 0.7 x VDD V V
Reference voltage inputs VSS + 1.6 VSS -250 - - 0.75 VDD +250 - V nA k VDD - 0.8 V
Oscillator: OSC, EXT input leakage current oscillator frequency 250 1.25 nA MHz
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
12 D/A CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RL = 10 k; CL = 100 pF; Tamb = -40 C to +85 C unless otherwise specified. SYMBOL Analog output VOA ILO Accuracy OSe Le Ge tDAC fDAC SNRR offset error linearity error gain error settling time conversion rate supply noise rejection ratio f = 100 Hz; VDDN = 0.1 x VPP no resistive load to 12 LSB full scale step Tamb = 25 C - - - - - - - - - - - 40 50 1.5 1 90 11.1 - mV LSB % s kHz dB output voltage output leakage current no resistive load RL = 10 k AOUT disabled VSS VSS - - - - VDD 0.9 x VDD 250 V V nA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
13 A/D CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RS = 10 k; Tamb = -40 C to +85 C unless otherwise specified. SYMBOL Analog inputs VIA ILIA CIA CID VIS VID analog input voltage analog input leakage current analog input capacitance differential input capacitance single-ended voltage differential voltage measuring range measuring range; VFS = VREF - VAGND VSS - - - VAGND - V FS -----------2 - - - Vi = 16 LSB - - f = 100 Hz; VDDN = 0.1 x VPP - - - - - 10 10 - - VDD 100 - - VREF +V FS ------------2 V nA pF pF V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Accuracy OSe Le Ge GSe CMRR SNRR tADC fADC offset error linearity error gain error small-signal gain error common-mode rejection ratio supply noise rejection ratio conversion time sampling/conversion rate Tamb = 25 C - - - - 60 40 - - 20 1.5 1 5 - - 90 11.1 mV LSB % % dB dB s kHz
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
(a) Internal oscillator; Tamb = +27 C.
(b) External oscillator.
Fig.17 Operating supply current as a function of supply voltage (analog output disabled).
(a) Output impedance near negative power rail; Tamb = +27 C. The x-axis represents the hex input-code equivalent of the output voltage.
(b) Output impedance near positive power rail; Tamb = +27 C.
Fig.18 Output impedance of analog output buffer (near power rails).
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
14 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL I2C-bus timing (see Fig.19; note 1) fSCL tSP tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure "The I2C-bus and how to use it". This brochure may be ordered using the code 9398 393 40011. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW-to-data out valid STOP condition set-up time - - 4.7 4.7 4.0 4.7 4.0 - - 250 0 - 4.0 - - - - - - - - - - - - - 100 100 - - - - - 1.0 0.3 - - 3.4 - kHz ns s s s s s s s ns ns s s PARAMETER MIN. TYP. MAX. UNIT
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t SU;STA
t LOW
t HIGH
1 / f SCL
SCL
t
BUF
tr
t
f
SDA
t HD;STA
t SU;DAT
t
HD;DAT
t VD;DAT
MBD820
t SU;STO
Fig.19 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
15 APPLICATION INFORMATION
PCF8591
Inputs must be connected to VSS or VDD when not in use. Analog inputs may also be connected to AGND or VREF. In order to prevent excessive ground and supply noise and to minimize cross-talk of the digital to analog signal paths the user has to design the printed-circuit board layout very carefully. Supply lines common to a PCF8591 device and noisy digital circuits and ground loops should be avoided. Decoupling capacitors (>10 F) are recommended for power supply and reference voltage inputs.
Fig.20 Application diagram.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
16 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
PCF8591
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
PCF8591
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
17 SOLDERING 17.1 Introduction
PCF8591
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 17.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 17.2 17.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 17.3 17.3.1 SO REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
18 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF8591
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 19 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 20 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
NOTES
PCF8591
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Philips Semiconductors
Product specification
8-bit A/D and D/A converter
NOTES
PCF8591
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415106/1200/04/pp28
Date of release: 1998 Jul 02
Document order number:
9397 750 04058

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